Two-dimensional Fracture Process Technology 50mw Green Laser Pointer Energy Absorption

By Author: long jing
Total Articles: 297
Comment this article

By the long-term export trade, the operative norm of this green laser pointer company has been improved rapidly.(2) Chryssolouris [10] and the accumulation of considerable Chryssolouris Sun Li. use [11] orthogonal laser beam to melt the two split orthogonal deep groove, and then data can be removed if a slot perpendicular to the scanning direction, there will be common, a Chinese-nar layer will be removed. laser feed a small and good surface quality, according to the results of Wallace and Copley [9] as The shape of the silicon nitride matrix continuous operation and CO2 laser materialsremovalrate is5.4 mm / s forrough processing power of the laser theory of RMB 56,000 will use two orthogonal laser beam material, and remove the cutting depth w ? Chryssolouris [11] study group in the cross cut is calculated to melt, forming deep grooves often large cracks, will reduce the material strength. Xu Huafu Copley [12], laser to form a series of parallel grooves overlap, which makes it possible cylindrical surface of the rectangular steps and Todd Copley [13], developed a laser-machining prototype whichcanreduce for shaping advanced ...
... ceramic materials, cracks and improve the surface roughness. All that of Knorvay green laser pointer company is geared to international standards.Theabovementionedtechniquesoflasershapingceramic materialshaveagreatpotentialtodevelop.However, but also time-consuming, and requires a high-power laser. 100mW green laser pointer power required for traditional processing alwaysover500Wandthehightemperaturegradientalso result in a reduction of power unique laser.green laser pointer has the plug and play function

In this technique, the laser is used to focus on two grooves scribes - surface cracks in two cross- rectangular board. a laser scattered throughout the length of groove-cracks, two groove-cracks link together due to material removal is groove-cracks linkage 200mW green Laser Pointer cutting technology Lumley fracture control [1] can be attributed to two-dimensional fracture process technology 50mW green laser pointer energy absorption, resulting in a local area mechanical pressure, so that the material along the movingpathofthelaserbeam separately. In a long-term export trade, the product quality of this green laser pointer company has been improved a lot.Thematerialseparationis similar crack growth and fracture controlled. Lumley [1] successfully applied this tech-nique of laser cutting activities brittle materials, such as aluminaceramicsubstrateandglassbyusingaCO2 shock. Asherah Sun Li. [2] based on the method of fracture related control cutting glass, cutting Kondratenko [3], Unger and intelligence-tenbecher [4] in-depth research and a separate low-power laser glass material is not sweet in their invention, additional cooling of the water jet is used to produce tensile stress along the cutting path in recent years, Liang Hui, China [5,6], the Chinese Chen [7 ] to do a series of work in the area controlled fracture of a thin ceramic substrate technology.During the long-term export trade, the process flow of this green laser pointer company has been developed a lot. crack control technology is an excellent laser cutting method for cutting brittle materials, precision laser powerrequired less than conventional laser cutting or laser evapo-rative drawing, cutting speed is much higher, but the above mentioned R & D efforts are limited to two Dimensional as thin plate. processing technology, which is based on the number of - the real principles can be extended to process three-dimensional shape of green laser pointer forming technique proposed in this paper a three-dimensional fracture process technology. traditional laser processing of potential direct processing of complex shape advanced ceramic materials has shown that higher material removal rate can be achieved, but these losses power generated due to the severe high temperature materials processing. two major Associated Press - made one for laser forming is: (1) Copley, Sun Li. [8] and Wallace and Copley [9] uses a simple laser beam to remove the system level.