Intermediate Inspection Of Green Laser Pointer

By Author: janney
Total Articles: 32
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Actually, intermediate inspection of green laser pointer is a kind of very important process. Readings are high and the horizon line of sight with a large number bar code image partition was treated averaged out, thereby undermining the scale partition errors. Most instruments have multiple readings and average features, can weaken the impact of external conditions. Unskilled operators can carry out high-precision measurement industry. Speed. By eliminating the reported number, listen to recorded, on-site computing time and the number of re-test of human error, measurement time compared with traditional instruments can save 1 / 3. And high efficiency. Just focus and keys can be automatically read, reduce labor intensity. Line of sight can also automatically record check, and can handle input into computer for post-processing can be integrated solid lines inside and outside the industry. Topcon DL Series electronic level as a member of the family. High performance, low price by the majority of users. DL series of beautiful shape, strong built-in features, menus ...
... feature-rich, user-friendly, have prompted all kinds of information, which greatly facilitates the actual operation. The manager insists that the intermediate inspection of 200mW Laser Pointer  should be performed strictly.

Semiconductor lasers based on semiconductor materials, do some physical work generated by the stimulated emission devices for the working principle is, by some incentives, in the semiconductor material of the band (the conduction band and valence band), or between the semiconductor material The band and impurity (acceptor or donor) level between the non-equilibrium carriers to achieve the population inversion, when inversion state in a large number of electron and hole recombination, the role of stimulated emission arises Semiconductor lasers, there are three main incentives that power injection, optical pump-and high-energy electron beam excitation type. power semiconductor laser injection, usually by GaAS (gallium arsenide), InAS (InAs), Insb ( InSb) semiconductor materials such as junction diodes along the forward bias injection current for incentives, in the end surface area produced by the stimulated emission. optically pumped semiconductor lasers, generally with N-type or P-type semiconductor crystal (such as GaAS, InAs, InSb, etc.) to do the work material, issued by other lasers for optical pumping of laser excitation. high-energy electron beam excitation semiconductor laser is generally used N-type or P-type semiconductor crystals (such as PbS, CdS, ZhO etc.) to do the work material, through high-energy electron beam injected from the outside to inspire in the semiconductor laser device, the current performance is better, is a broader application of the electric double-heterostructure GaAs diode laser injection. The intermediate inspection of 100mW laser pointer  has got a very good result.

Semiconductor laser works by incentives, the use of semiconductor materials (both electronic) transitions in the band between the light-emitting, semiconductor crystal cleavage plane to form two parallel mirrors as reflectors to form a resonant cavity, so that the light oscillation, feedback, produce light radiation amplification, the output laser. Semiconductor lasers advantage of small size, light weight, reliable operation, low power consumption and high efficiency. Semiconductor laser packaging technology, mostly in discrete packaging technology based on the development and evolved, but there is great specificity . In general, discrete devices die is sealed in the package body, the main role of packaging is to protect the die and complete the electrical interconnection. The semiconductor laser package is the complete output signal, to protect the die work, output: visible features, both electrical parameters, there are optical parameters of design and technical requirements, not simply discrete package for semiconductor lasers . Part of the core light-emitting semiconductor laser is p-type and n-type semiconductor pn junction consisting of the die, when injected into the pn junction of the minority carrier and majority carrier recombination time, we will send visible light, ultraviolet light or near infrared light. The intermediate inspection of Blue Laser Pointer will influence the quality review result of green laser pointer.

But pn junction emit photons non-directional, ie fired in all directions have the same probability, therefore, not all the light generated by the die can be released, depending on the quality of semiconductor materials, structure and geometry of the die , the internal structure and encapsulation materials, packaging, semiconductor lasers application requirements to improve internal and external quantum efficiency. Conventional semiconductor laser package Φ5mm side length is 0.25mm square die bonding or sintering the wire rack, die by the positive point of contact with the gold ball, for the inner lead bonding with a pin connected to the cathode through the reflector and the other pin is connected to the lead frame, and then the top with epoxy resin. The role of reflective glass to collect the side of the die, the light emitted by the interface to the desired direction of the angle of emission. Top made of epoxy resin encapsulation of a certain shape, such types of functions: to protect the die from the outside world such as erosion; different shapes and material properties (doped or not doped bulk reagent), or diffuse from the lens lens, control the light divergence angle; tube core refractive index of air associated with the large refractive index, resulting in the die is very small within the total reflection critical angle, the light generated by the active layer is removed only a small part of the most easily in by multiple reflections within the die has been absorbed, prone to result in excessive total reflection of light loss, the corresponding refractive index of the epoxy resin used to make the transition, to improve die efficiency of light emitted. The epoxy resin composition for shell and tube must have moisture resistance, insulation resistance, mechanical strength, the refractive index of light emitted by the die and the transmission rate. The customer is very satisfied with the intermediate inspection of 5mW laser pointer.

Select a different refractive index of packaging materials, packaging geometry of the efficiency of photon escape is different, the angular distribution of light intensity and structure of the die, the light output mode, the lens used in packaging material and shape. The use of a tapered resin lens can focus light to a semiconductor laser in the axial direction, the corresponding angle smaller; if the top of the resin lens is round or flat type, the corresponding angle will increase. Under normal circumstances, the semiconductor laser emission wavelength with temperature changes of 0.2-0.3nm / ℃, spectral width increases, affecting the color brightness. In addition, when the forward current flows through the pn junction, fever, loss of the junction of temperature rise, at room temperature near the temperature is increased by 1 ℃, light-emitting semiconductor laser intensity with a corresponding reduction of about 1%, package heat; keep color purity and luminous intensity is very important, in the past to use more ways to reduce the drive current and reduce the junction temperature, the majority of the semiconductor laser drive current is limited to 20mA or so. However, the semiconductor laser light output will increase with the increase of current, present, many power semiconductor laser drive current up to 70mA, 100mA or 1A level, need to improve the packaging structure, a new semiconductor laser package design and low heat resistance package structure and technology to improve the thermal characteristics. For example, using a large area flip-chip structure, selection of good thermal conductivity of silver plastic, metal stents increases the surface area of silicon carrier solder bump directly mounted on the upper heat sink method. The result of the intermediate inspection of green laser pointer should be recorded in the test report of green laser pointer.
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