Integrated Circuit Packaging Has Ic Substrate As Its Foundation

By Author: Ryan
Total Articles: 75
Comment this article

A list of the main materials used in IC packaging substrate includes the laminate substrates, lead frame, bonding wire, encapsulation material, underfill, die attach material, WLP dielectric, and WLP plating chemicals. All these materials are used in packaging and interconnection of the IC chips to the outer appliances including printed circuit boards (PCBs), to mention but a few, besides supporting and cooling roles. Market share for the use of these materials is illustrated below.


As mentioned earlier, laminate substrates are dominant in the packaging materials market of IC So it is worth going a little in detail about this material. An Integrated Circuit (IC) substrate is defined as the foundation or building materials of an Integrated Circuit package and is the intermediary between the IC and the whole network of PCB traces. These substrates have multiple layers, a middle core layer, a network of drill holes, and conductor pads that make their fabrication different and more challenging as compared to traditional PCBs.


Classifications of IC substrates


Based on some parameters, ...
... IC substrates can be classified as follows Material: Type of metal used Structures: Layers of metal fabrication techniques: Thick film, thin film, etc. Here are some common classifications of IC substrates:


Material-based classification: IC substrates can be made with several materials such as ceramic, silicon, and organic materials including BT resin, FR4, or polyimide.


Structure-based classification: Organic and printed circuit substrates can be divided into single-layer substrates and multi-layer substrates. Single-layer substrates are common for low density of the FPGA while multi-layer substrates are relevant when several circuits of high density are involved.


Fabrication method-based classification: IC substrates can also be sorted depending on the technique used during the fabrication process, these include the subtractive technique, additive technique, or semi-additive technique.


Technology-based classification: IC substrates can also be categorized according to the technology utilized by them such as flip-chip technology or wire-bonding technology.


Application-based classification: Memory types in counters IC substrates, it is possible to classify them in line with the applications they may include; memory, processors, sensors, power devices, and many more.


These classifications assist in the selection of a proper IC substrate for a certain application with added parameters such as cost, performance, and reliability.


IC substrates can be classified into three main categories: the package/packaging type, the bonding technology adopted, and the material attributes/characteristics.


Package/ Packaging Type:


The package type is mainly the carrier type for the IC substrate.


Ball Grid Array IC substrate: Another type of substrate suitable for IC packages is the one that comes with many pins greater than 300. They are characterized by great electric performance and heat dissipation.


Chip-scale package IC substrate: This type of substrate is thin with small pads best suited for low-profile single chip packages with few pins (CSPs).


Flip-chip IC substrate is used for controlled collapse chip connections in a flip-chip chip-scale package (FCCSP). It has shield protection against heat, circuit loss, and signal interference to improve its efficiency.


Multi-chip module IC substrate: In this type of packaging, there are substrates where several numbers of ICs that perform different functions are accommodated. The substrate should therefore be lightweight it will not necessarily have good signal sound interference, routing, or heat dissipation due to MCM ICs.


The bonding technology means how the integrated circuit attaches to the package or other external circuits.


Wire bonding: This is the most common type of bonding, in which wires are run from the connections on the chip to the package/carrier or the external circuit.


Tape Automated Bonding (TAB): FPC is described as the process through which manufacturers search for a flexible printed circuit by abutting an integrated circuit to thin conductors on a polymer-based substrate.


Flip Chip (FC): This kind of bonding is most often used in cases where solder balls/bumps are employed to provide interconnections. This bond can be forged using a polymer adhesive, a welded joint, or a solder material interface.


Because integrated circuits perform different functions, their substrates will be of a given type and possess certain characteristics.


Rigid: These types of substrates are made of Resin which can be Ajinomoto Build-up Film (ABF), Epoxy, or Bismaleimide Triazine (BT).


Flex: This type of IC packaging substrate can be made from Polyimide or Polyamide resin. The electrical performance and the coefficient of thermal expansion of both materials are comparable.


Ceramic: This type of substrate is made of ceramic material with aluminum nitride, silicon carbide, or aluminum oxide as its standard component.


Laminate substrates are used in electronics products in various capacities.


Microprocessors: IC substrate PCBs are usually; employed in microprocessors, which are the control centers of electronic equipment. These PCBs have applications in microprocessors since they act as support structures for mounting the microprocessor chips.


Memory modules: IC Substrate PCBs are also applied in the production of memory modules which can be found in most electronic equipment. These PCBs offer a plane for the mounting of the memory chips as well as keep the memory modules running effectively.


Consumer electronics (smartphones, tablets, laptops, among others): The application of these PCBs is to offer the ground where the different elements of these devices can be mounted with significantly minimized size and weight.


Industrial electronics: IC substrate PCBs are applicable for use in different industries such as automation industries, Robotics industries, and control industries. These PCBs are more efficient in providing a stable base on which all the electronic components employed in such systems are fixed.


Automotive electronics: These IC substrate PCBs are equally applicable in automobile electronics like control mechanisms of engines, entertainment systems, and many more circuitries. These PCBs are purposely built to meet automotive requirements in terms of use and can operate under hard conditions hence being efficient.


Characteristics of laminate substrates


An IC substrate is an essential part of electronic devices, and what makes it suitable to use is that it has some critical features.


Electrical properties: This paper shows how the electrical properties of an IC substrate directly impact its proper functioning. For effective transfer of electrical signals, the substrate should have low electrical resistance while having suitable signal integrity.


Thermal conductivity: In addition, the material of IC substrates has to have high thermal conductivity to facilitate the dissipation of heat produced by the ICs. This characteristic is also critical in stopping the ICs from overheating in operation and therefore becoming completely dysfunctional.


Mechanical strength: The IC substrate also needs to possess sufficient mechanical strength to endure stress and/or physical impacts when in the process of handling or assembling it.


Dielectric properties: IC Substrate material must have some high dielectric constant to minimize the signal attenuation and to improve the signal strength.


Chemical resistance: IC substrates are required to have a very high chemical resistance to ensure that the various chemicals that may be used in the manufacturing and testing of the substrates do not affect them in any way.


Surface properties: An IC substrate surface should have mechanical strength to facilitate the formation of a layer of thin films and bonding wire on its surface.


Compatibility: Before the IC packaging substrate can be incorporated the substrates must support the technology used in packaging of the IC.

High Quality PCB Co., Limited is a leading PCB(Printed Circuit Board) Manufacturer in China since 1995. Dedicated to the technologies innovation, being engaged in IC Substrates, High-Density Interconnect PCB, Multi-layer PCB, Rigid Flexible PCB, Flexible, Radiofrequency PCB.