Sk Hynix Joins Tsmc To Boost Hbm Leadership

By Author: Ben Gross
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SK hynix Inc. has just announced a new partnership with TSMC to collaborate on the production of next-generation HBM and to enhance logic and HBM integration using advanced packaging technology. This exciting initiative will pave the way for the development of HBM4, the sixth generation of the HBM family, which is set to be mass produced starting from 2026.

According to SK hynix, this collaboration between the leading AI memory company and TSMC, a top global logic foundry, will bring about even more innovations in HBM technology. It is also expected to result in significant advancements in memory performance through a trilateral collaboration between product design, foundry, and memory provider.

The primary focus of this partnership will be on improving the performance of the base die, which is located at the bottom of the HBM package. HBM is created by stacking a core DRAM die on top of a base die that utilizes TSV technology. The layers in the DRAM stack are then vertically connected to the core die using TSV, forming the HBM package. The base die, which is connected to the GPU responsible for controlling the ...
... HBM, plays a crucial role in the overall performance of the package.

More Information : https://www.techdogs.com/tech-news/pr-newswire/sk-hynix-partners-with-tsmc-to-strengthen-hbm-technological-leadership