Lucintel Forecasts Semiconductor Packaging Material Market To Reach $50.6 Billion By 2028

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According to the recent study the semiconductor packaging material market is projected to reach an estimated $50.6 billion by 2028 from $36.0 billion in 2023, at a CAGR of 7.1% from 2023 to 2028. Growth in this market is primarily driven by growing trend of miniaturization of the electronic devices across the world and high demand for mobile phones, tablets, and other communication devices.
A more than 150–page report is developed to understand trends, opportunities and forecast in semiconductor packaging material market by product type (substrates, leadframes, bonding wires, encapsulants, underfill materials, die attach, solder balls, wafer-level package dielectrics, and others), technology (grid array, small outline package, dual flat no-leads, quad flat package, dual in-line package, and others), end use industry (consumer electronics, aerospace & defense, healthcare, communication, automotive, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Download sample report by clicking on below link https://www.lucintel.com/semiconductor-packaging-materials-market.aspx

“Substrate ...
... market is expected to remain the largest segment during the forecast period.”
Based on product type, the semiconductor packaging material market is segmented into substrates, leadframes, bonding wires, encapsulants, underfill materials, die attach, solder balls, wafer-level package dielectrics, and others. Lucintel forecasts that the substrate market is expected to remain the largest segment due to the growing demand for system-in-package (SIP) and high-performance devices and rising usage of this product to transmit electricity from the semiconductor to the mainboard and secure the semiconductor from external damage.
“Within the semiconductor packaging material market, the consumer electronics segment is expected to remain the largest end use industry.”
Based on end use industry the consumer electronics segment is expected to witness the highest growth over the forecast period due to the increasing number of demand for smartphones and significant use of semiconductor packing in the electronic products.
“Asia pacific will dominate the semiconductor packaging material market in near future.”
Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to the high demand for electronic packaging materials and for consumer electronics in China, Taiwan, and India.
Download Brochure of this report by clicking on https://www.lucintel.com/semiconductor-packaging-materials-market.aspx.
Major players of semiconductor packaging material market are adopting various growth strategies like new product launches, expansions, merger and acquisitions, partnerships, agreements, and collaborations to expand their presence in this market. Henkel, Hitachi Chemical Company, Sumitomo Chemical, Kyocera Chemical, and Toray Industries are among the major semiconductor packaging material providers.
This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/semiconductor-packaging-materials-market.aspx or helpdesk@lucintel.com
About Lucintel
At Lucintel, we offer solutions for you growth through game changer ideas and robust market & unmet needs analysis. We are based in Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20 years. We are quoted in several publications like the Wall Street Journal, ZACKS, and the Financial Times. For further information, visit www.lucintel.com.
Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. 972.636.5056
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