Lucintel Forecasts Bonding Film Market To Reach $1.6 Billion By 2027

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According to the recent study the Bonding Film Market is projected to reach an estimated $1.6 billion by 2027 from $XX billion in 2021, at a CAGR of 6% from 2021 to 2027. Growth in this market is primarily driven by rising wave of new technologies, such as pressure cured bonding films are creating significant potential for bonding film in transportation, electrical and electronics, and packaging applications, due to its improved product durability, reliability, fast curing time, increased product performance, and design flexibility.
Browse 142 figures / charts and 107 tables in this 150 -page report to understand trends, opportunities and forecast in bonding film market by application (transportation, electrical & electronics, packaging, and others), material technology (thermally cured bonding film, pressure cured bonding film, and other) and region (North America, Europe, Asia Pacific, and the Rest of the World).
Download sample report by clicking on below link https://www.lucintel.com/technology-bonding-film-market.aspx

“Thermally cured market is expected to remain the largest segment during the ...
... forecast period.”
Based on material technology, the bonding film market is segmented into thermally cured bonding film, pressure cured bonding film, and other. Lucintel forecasts that the thermally cured market is expected to remain the largest segment due to widespread application of this technology across the end use industry for better adhesion properties and suitable for high temperature area‘s application manufacturing.
“Within the bonding film market, the electrical & electronics segment is expected to remain the largest application.”
Based on application the electrical & electronics segment is expected to witness the highest growth over the forecast period due to increasing demand from semiconductor packaging market.
“Asia pacific will dominate the bonding film market in near future.”
Asia Pacific is projected to remain the largest region over the forecast period due to increasing demand for bonding films from various end use industries, such as electrical & electronics and transportation.
Download Brochure of this report by clicking on https://www.lucintel.com/technology-bonding-film-market.aspx
Major players of bonding film market are adopting various growth strategies like new product launches, expansions, merger and acquisitions, partnerships, agreements, and collaborations to expand their presence in this market. Arkema, Cytec Solvay Group, Dai Nippon Printing, DuPont, Fastel Adhesives and Substrate Products, Formplast, Gurit, H.B. Fuller, Henkel AG, Hexcel Corporation are among the major bonding film providers.

This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/technology-bonding-film-market.aspx or helpdesk@lucintel.com
About Lucintel
At Lucintel, we offer solutions for you growth through game changer ideas and robust market & unmet needs analysis. We are based in Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20 years. We are quoted in several publications like the Wall Street Journal, ZACKS, and the Financial Times. For further information, visit www.lucintel.com.

Contact:
Brandon Fitzgerald
Lucintel
Dallas, Texas, USA
Email: brandon.fitzgerald@lucintel.com
Tel. 972.636.5056
Cell: 303.775.0751
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