Flip-chip Is Expected To Remain The Largest Segment In The Global Advanced Ic Packaging Market

By Author: Lucintel LLC
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An exciting new study from the team of Lucintel found that advanced IC packaging market is expected to reach $50.1 billion by 2026 with a CAGR of 8%. There are significant money making opportunities available in this market and companies planning to enter this market need to differentiate in order to maximize their return on investment.
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The advanced IC packaging market is segmented based on packaging type, end use industry, and region. In this market, flip-chip is the largest segment by packaging type, whereas consumer and communication is largest by end use industry. Players can benefit from the available opportunities like economic growth, growing urbanization, growing disposable income, and increasing adoption of digital technologies, such as 5G, Internet of things (IoT), and artificial intelligence (AI) are driving the demand for advanced IC packaging market in this region.
The development of packaging solutions for AI and IoT and introduction of new IC packaging technologies, such as fan out and ...
... 2.5D/3D are emerging trends having impact on dynamics of the industry.
Amkor, Taiwan Semiconductor, Advanced Semiconductor Engineering Technology, Intel, and Samsung are some of the major players profiled in this 138 -page report.
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https://www.lucintel.com/advanced-ic-packaging-market.aspx
Some of the Key Questions answered in this exclusive report are:
Q.1 What are some of the most promising, high-growth opportunities for the advanced IC packaging market by packaging type (flip-chip, fan-in wafer level packaging, embedded-die, fan-out, and 2.5D/3D) end use industry (consumer and communication, automotive, industrial, healthcare, aerospace and defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 What are the business risks and threats to the advanced IC packaging market?
Q.4 What are some changing demands of customers in the advanced IC packaging market?
Q.5 What are the new developments in the advanced IC packaging market? Which companies are leading these developments?
Q.6 What strategic initiatives are being implemented by key players for business growth?
Q.7 What are some of the competitive products and processes in this advanced IC packaging area and how big of a threat do they pose for loss of market share via product substitution?
Q.8 What M&A activity has occurred in the last 5 years in this advanced IC packaging market?
This unique report from Lucintel will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link helpdesk@lucintel.com
About Lucintel
Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.
Brandon Fitzgerald
Lucintel
Dallas, Texas, USA
Email: brandon.fitzgerald@lucintel.com
Tel. 972.636.5056
Cell: 303.775.0751
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